Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly nonmetal substrate
Reexamination Certificate
2005-04-12
2005-04-12
Wong, Edna (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating predominantly nonmetal substrate
C205S164000, C205S167000, C205S169000, C205S210000, C205S221000, C205S223000, C205S118000, C205S136000, C427S259000, C427S331000
Reexamination Certificate
active
06878260
ABSTRACT:
A process for forming an interface (106) between a plated and a non-plated area (102, 104) on the surface of a plastic component (100) is disclosed. First, an anti-plating layer (110) is formed over the surface of the plastic component. Thereafter, a low-power laser beam (10) is used to remove a portion of the anti-plating layer and to form an interface between the plated area and the non-plated area. A seeding layer (120) is formed on the plated area so that the plated area is electrically conductive. Finally, a metallic layer (130) is electrically plated over the seeding layer. The metallic layer connects with the anti-plating layer via the interface. The cost of producing the anti-plating layer is low. Moreover, since the laser etching operation is able to produce a high-quality interface boundary between the plated and the non-plated area, yield of the process is improved.
REFERENCES:
patent: 5830376 (1998-11-01), Bohlke et al.
Hsu Steven
Huang Che-Hung
High Tech Computer Corp.
J.C. Patents
Wong Edna
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