Process for forming a high density metallurgy system on a substr

Details Process for forming a high density metallurgy system on a substr Process for forming a high density metallurgy system on a substr

1985-03-04

1985-12-31

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 685, 361404, 361406, 361414, H05K 114

Patent

active

045625131

ABSTRACT:
A process for forming a high density solder pad and fan-out metallurgy system in a ceramic substrate wherein a pattern of indented lines is formed in the surface of a green ceramic substrate, the lines filled with a conductive metal paste, a layer of dielectric green ceramic material deposited over at least a portion of the area of the pattern of indented lines, and sintering the resultant substrate.

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patent: 4443278 (1984-04-01), Zingher
patent: 4498122 (1985-02-01), Rainal
patent: 4532152 (1985-07-01), Elarde

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