Process for forming a high density metallurgy system on a substr

Details Process for forming a high density metallurgy system on a substr Process for forming a high density metallurgy system on a substr

1984-05-21

1985-06-04

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

29851, 29852, 264 61, 427 97, H05K 312, H05K 346

Patent

active

045214492

ABSTRACT:
A process for forming a high density solder pad and fan-out metallurgy system in a ceramic substrate wherein a pattern of indented lines is formed in the surface of a green ceramic substrate, the lines filled with a conductive metal paste, a layer of dielectric green ceramic material deposited over at least a portion of the area of the pattern of indented lines, and sintering the resultant substrate.

REFERENCES:
patent: 3978248 (1976-08-01), Usami
patent: 4109377 (1978-08-01), Blazick
patent: 4245273 (1981-01-01), Feinberg
patent: 4340618 (1982-07-01), Fury
patent: 4374457 (1983-02-01), Wiech
patent: 4442137 (1984-04-01), Kumar

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