Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-03-13
2007-03-13
Chambliss, Alonzo (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S118000, C438S126000, C438S127000, C438S622000
Reexamination Certificate
active
09661899
ABSTRACT:
A method of fabricating microelectronic dice by providing or forming a first encapsulated die assembly and a second encapsulated die assembly. Each of the encapsulated die assemblies includes at least one microelectronic die disposed in a packaging material. Each of the encapsulated die assemblies has an active surface and a back surface. The encapsulated die assemblies are attached together in a back surface-to-back surface arrangement. Build-up layers are then formed on the active surfaces of the first and second encapsulated assemblies, preferably, simultaneously. Thereafter, the microelectronic dice are singulated, if required, and the microelectronic dice of the first encapsulated die assembly are separated from the microelectronic dice of the second encapsulated die assembly.
REFERENCES:
patent: 5048179 (1991-09-01), Shindo et al.
patent: 5280192 (1994-01-01), Kryzaniwsky
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5422513 (1995-06-01), Marcinkiewicz et al.
patent: 5497033 (1996-03-01), Fillion et al.
patent: 5527741 (1996-06-01), Cole et al.
patent: 5703400 (1997-12-01), Wojnarowski et al.
patent: 5745984 (1998-05-01), Cole, Jr. et al.
patent: 5798564 (1998-08-01), Eng et al.
patent: 5838061 (1998-11-01), Kim
patent: 5861666 (1999-01-01), Bellaar
patent: 5883426 (1999-03-01), Tokuno et al.
patent: 5977640 (1999-11-01), Bertin et al.
patent: 6002167 (1999-12-01), Hatano et al.
patent: 6013948 (2000-01-01), Akram et al.
patent: 6072700 (2000-01-01), Nam
patent: 6084294 (2000-07-01), Tomita
patent: 6087718 (2000-07-01), Cho
patent: 6087719 (2000-07-01), Tsunashima
patent: 6091142 (2000-07-01), Lee
patent: 6118184 (2000-09-01), Ishio et al.
patent: 6133637 (2000-10-01), Hikita et al.
patent: 6137162 (2000-10-01), Park et al.
patent: 6137163 (2000-10-01), Kim et al.
patent: 6154366 (2000-11-01), Ma et al.
patent: 6271469 (2001-08-01), Ma et al.
patent: 11045955 (1999-02-01), None
patent: 11312868 (1999-11-01), None
Ma Qing
Mu Chun
Towle Steven
Vu Quat
Chambliss Alonzo
Intel Corporation
Schwegman Lundberg Woessner & Kluth P.A.
LandOfFree
Process for forming a direct build-up layer on an... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Process for forming a direct build-up layer on an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for forming a direct build-up layer on an... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3731492