Package making – Methods – Filling preformed receptacle and closing
Patent
1982-07-29
1983-07-19
Hoag, Willard E.
Package making
Methods
Filling preformed receptacle and closing
53452, 53467, 53474, 53476, 264255, 264262, 264267, 264304, 264334, B29D 300, B65B 728
Patent
active
043936431
ABSTRACT:
A process for forming a barrier phase between two incompatible phases comprising forming a thin layer of barrier material on the outer surface of a pin; placing the coated pin into a package or mold form designed to contain the total product; putting the molten outer phase into the space between the coated pin and the outer wall(s) of the package or mold form and allowing the outer phase to solidify; removing the pin leaving the barrier phase attached to the outer phase; and putting the inner phase into the space previously occupied by the pin.
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Fryar Durward
Schmitz Jerome J.
Gorman John V.
Hoag Willard E.
Mohl Douglas C.
The Procter & Gamble & Company
Witte Richard C.
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