Process for forming a barrier phase

Package making – Methods – Filling preformed receptacle and closing

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Details

53452, 53467, 53474, 53476, 264255, 264262, 264267, 264304, 264334, B29D 300, B65B 728

Patent

active

043936431

ABSTRACT:
A process for forming a barrier phase between two incompatible phases comprising forming a thin layer of barrier material on the outer surface of a pin; placing the coated pin into a package or mold form designed to contain the total product; putting the molten outer phase into the space between the coated pin and the outer wall(s) of the package or mold form and allowing the outer phase to solidify; removing the pin leaving the barrier phase attached to the outer phase; and putting the inner phase into the space previously occupied by the pin.

REFERENCES:
patent: 1917483 (1933-07-01), Arimoto
patent: 1919692 (1933-07-01), Falkendorf
patent: 1987084 (1935-01-01), Snodgrass
patent: 2299039 (1935-01-01), Scherer
patent: 3279999 (1966-10-01), Harrison et al.
patent: 3315344 (1967-04-01), Niclas
patent: 3462524 (1969-08-01), Lemelson
patent: 3794453 (1974-02-01), Padilla et al.
patent: 3961089 (1976-06-01), Dogliotte
patent: 4054636 (1977-10-01), Menig
patent: 4076788 (1978-02-01), Ditto
patent: 4147750 (1979-04-01), Gerea et al.
patent: 4172113 (1979-10-01), Featherstone et al.
patent: 4202879 (1980-05-01), Shelton
patent: 4222973 (1980-09-01), Kasper

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