Process for flip-chip bonding a semiconductor chip using wire le

Details Process for flip-chip bonding a semiconductor chip using wire le Process for flip-chip bonding a semiconductor chip using wire le

1993-09-17

1995-08-01

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437209, 29850, 2281805, H01L 21283, H01L 2158, H01L 21603

Patent

active

054380200

ABSTRACT:
A flip-chip process in which the chip is positioned with its contacts facing a substrate. Small gold balls, obtained by the melting of the end of a gold wire, are soldered to the contacts of the chip and a segment of the gold wire is left attached to the ball. The mounting on the substrate is under heat, for example by means of a heating table, by positioning the chip on the substrate and by making use, for this purpose, of wire segments that are suitably arranged during an intermediate operation which consists of folding them in a predetermined way. A solder paste, deposited beforehand by means of a stencil, provides for the soldering between the balls and the facing parts of the conductors of the substrate.

REFERENCES:
patent: 3621565 (1971-11-01), Sandstrom et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5173451 (1992-12-01), Kinsman et al.
IBM Technical Disclosure Bulletin, vol. 26, No. 38, Aug. 1983, New York, US, p. 1548, H. Andreas, et al., "Cooling System for Semiconductor Modules".

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