Process for flattening glass-ceramic substrates

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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264 58, 264 61, 264 62, 264 64, 264 65, 264 66, 427 96, B32B 3124, C03B 3200, C04B 3900

Patent

active

043404367

ABSTRACT:
The obtention of enhanced planarity and dimensional integrity of sintered glass-ceramic substrates containing multi-level distribution of conductor patterns (e.g. copper) by a two stage firing of the green sheets, first between the anneal and softening points of crystallizable glass particles, interrupting the firing, superimposing selected light weights on the substrates, and heating through the coalescing temperatures to the crystallization of the glass.

REFERENCES:
patent: 3879509 (1975-04-01), Elderbaum
patent: 4234367 (1981-11-01), Herron et al.
IBM TDB, vol. 23, No. 5, pp. 1885-1886, Oct. 1980, "Method for Reduction of Shrinkage Distortion in Ceramic Substrates", J. M. Brownlow et al.

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