Process for fabrication of thin film magnetic heads

Details Process for fabrication of thin film magnetic heads Process for fabrication of thin film magnetic heads

1994-04-22

1995-10-31

Powell, William

Etching a substrate: processes

Forming or treating article containing magnetically...

216 41, 360126, B44C 122, C23F 102

Patent

active

054626374

ABSTRACT:
A process for the fabrication of thin film magnetic heads from a wafer is disclosed that provides improved stud adhesion, reduced risk of contamination, and elimination of corrosive elements along the magnetic pole tips. The process includes the steps of forming a first pole tip, forming simultaneously a second pole tip, lead straps and a layer at each stud location from plated pole tip material; applying a thin overcoat layer to the wafer; applying a first mask with an opening over each stud; removing the overcoat material in each opening with a noncorrosive etchant to expose the stud layer; removing the mask; applying a NiFe seed layer to the wafer; applying a second mask to the wafer having an opening over each stud slightly larger than that of the first mask; plating gold into each opening; and removing the second mask and the remaining seed layer.

REFERENCES:
patent: 4791719 (1988-12-01), Kobayashi et al.
patent: 4841624 (1989-06-01), Togawa et al.
patent: 5200056 (1993-04-01), Cohen et al.
Anonymous, "Improved Overcoat Technique for Thin Heads", Research Disclosure, Mar. 1987, No. 275, p. 146.

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