Process for fabrication of a selectively filled flexible adhesiv

Details Process for fabrication of a selectively filled flexible adhesiv Process for fabrication of a selectively filled flexible adhesiv

1997-07-17

1998-08-25

Powell, William

Etching a substrate: processes

Forming or treating electrical conductor article

Adhesive or autogenous bonding of self-sustaining preforms

216 33, B44C 122

Patent

active

057980500

ABSTRACT:
A process for fabrication of an electrically conductive adhesive film having a pattern of microscopic elongate metal particles which extend from one surface to the other to provide an interconnection between confronting conductive metal pads abutting the surface. The particles have sharp ends to penetrate the oxide coating on the conductive metal pads of an electronic module when force is applied to press the module against the film.

REFERENCES:
patent: 5169471 (1992-12-01), Strasser
patent: 5332869 (1994-07-01), Hagiwara

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