Process for fabricating improved multilayer interconnect systems

Details Process for fabricating improved multilayer interconnect systems Process for fabricating improved multilayer interconnect systems

1993-12-02

1995-01-17

Beck, Shrive

Coating processes

Electrical product produced

Metallic compound coating

427343, 4273855, 4274192, 4274431, B05D 512

Patent

active

053824474

ABSTRACT:
The invention provides a multilayer laminar interconnect package comprising a plurality of conductor circuit layers adhering to and sandwiched between a plurality of dielectric polyimide polymer layers where the conductor circuit layers are a circuit pattern of lines of conductive metal. The conductive metal, e.g. copper, is coated with a capping layer of a metal, e.g. cobalt, which capping layer is further characterized as having a thin layer of the capping metal oxide adhered to the surface thereof. The conductive layer is in contact with an overcoated polyimide dielectric layer such that the surface oxidized capping layer forms an adherent barrier layer at the interface of the polyimide and conductive line layers. The invention also provides a process for producing such interconnect packages.

REFERENCES:
patent: 4770899 (1988-08-01), Zeller
patent: 5112462 (1992-05-01), Swisher
patent: 5151304 (1992-09-01), Lee
patent: 5156732 (1992-10-01), Ogasawara et al.
patent: 5288519 (1994-02-01), Baumgartner et al.

Affiliated with

Also associated with

Rating

Process for fabricating improved multilayer interconnect systems does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for fabricating improved multilayer interconnect systems, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for fabricating improved multilayer interconnect systems will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-746205