Process for fabricating electron emitting device, electron...

Semiconductor device manufacturing: process – Chemical etching – Liquid phase etching

Reexamination Certificate

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C438S020000, C438S706000, C438S745000

Reexamination Certificate

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07435689

ABSTRACT:
A process for fabricating an electron emitting device comprises a cathode electrode and a gate electrode are laminated through an insulating layer and an electron emitting film on the cathode electrode located in a gate hole penetrating through the gate electrode and the insulating layer. Wherein, a second hole penetrating through at least the gate electrode between the insulating layer and the gate electrode is juxtaposed with a first hole as a gate hole is formed, and the insulating layer between the second hole and the first hole in which the electron emitting film is deposited to the inner wall surface is etched until the first hole and the second hole are communicated with each other. Thereby, electron emitting film material is removed form the hole to reduce a leakage current.

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patent: 7109663 (2006-09-01), Fujiwara et al.
patent: 2003/0067259 (2003-04-01), Nishimura
patent: 2006/0061289 (2006-03-01), Fujiwara et al.
patent: 2006/0125370 (2006-06-01), Nishimura et al.
patent: 8-96704 (1996-04-01), None
patent: 8-264109 (1996-10-01), None
patent: 2000-195448 (2000-07-01), None

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