Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1995-06-06
1996-10-22
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257698, 257730, H01L 2348, H01L 2304
Patent
active
055679846
ABSTRACT:
An electronic circuit package is fabricated by providing a substrate having attached to at least one of its major surfaces, at least one integrated circuit chip; and providing a carrier that comprises a polymeric composition. The carrier holds a desired array of conductive pins, which protrude from both major surfaces of the carrier. The substrate is placed in contact with the pins to provide a subassembly.
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Emerick Alan J.
Zalesinski Jerzy M.
Clark S. V.
Crane Sara W.
International Business Machines - Corporation
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