Process for fabricating an electronic circuit package

Details Process for fabricating an electronic circuit package Process for fabricating an electronic circuit package

1995-06-06

1996-10-22

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257698, 257730, H01L 2348, H01L 2304

Patent

active

055679846

ABSTRACT:
An electronic circuit package is fabricated by providing a substrate having attached to at least one of its major surfaces, at least one integrated circuit chip; and providing a carrier that comprises a polymeric composition. The carrier holds a desired array of conductive pins, which protrude from both major surfaces of the carrier. The substrate is placed in contact with the pins to provide a subassembly.

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