Process for fabricating an electronic circuit apparatus

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 4, 437 54, 437241, 148DIG1, 148DIG14, H01L 2170

Patent

active

053669215

ABSTRACT:
An electronic circuit apparatus which is constructed by laminating a plurality of thin films onto an insulative substrate. On the substrate, an electronic circuit element having two conductive layer which are laminated through an insulative layer is formed. The insulative layer is formed so as to cover the whole surface of the insulative substrate.

REFERENCES:
patent: 4396934 (1983-08-01), Nishida et al.
patent: 4405915 (1983-09-01), Komatsu et al.
patent: 4461956 (1984-07-01), Hatanaka et al.
patent: 4472730 (1984-09-01), Ohta
patent: 4532536 (1985-07-01), Hatanaka et al.
patent: 4636450 (1987-01-01), Ogawa et al.
patent: 4650984 (1987-03-01), Furushima et al.
patent: 4667214 (1987-05-01), Sekimura et al.
patent: 4913661 (1990-06-01), Fukaya et al.
patent: 4997773 (1991-03-01), Nobue et al.
Sze, Semiconductor Devices: Physics and Tech., 1985, pp. 360-361, 472, 474-475.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for fabricating an electronic circuit apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for fabricating an electronic circuit apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for fabricating an electronic circuit apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1991222

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.