Process for fabricating above and below ground plane wiring on o

Details Process for fabricating above and below ground plane wiring on o Process for fabricating above and below ground plane wiring on o

1976-06-30

1978-02-28

Mehr, Milton S.

Metal working

Method of mechanical manufacture

Electrical device making

427 63, 29577C, 307245, H05K 300

Patent

active

040757560

ABSTRACT:
A fabrication method for integrated circuits is disclosed wherein a structure is formed on one side of a supporting substrate which provides a ground plane with "X" wiring on one side and "Y" wiring on the other side thereof. The method includes a number of alternative initial planarization steps which permits the resulting device to be substantially planar, thereby allowing it to be used as a substrate for preparation of high density integrated circuits. A first planarization step includes the deposition of a niobium thin film on a doped silicon substrate; the delineation of the desired niobium "X" wiring pattern using well-known photolithographic and etching techniques, leaving the photoresist in place to protect the niobium; the anodization of exposed silicon substrate portions to form silicon dioxide surrounding the niobium to a higher level than the niobium; and the removal of the photoresist.

REFERENCES:
patent: 3351774 (1967-11-01), Porter
patent: 3366519 (1968-01-01), Pritchard et al.
patent: 3385773 (1968-05-01), Frantzen
patent: 3519481 (1970-07-01), Joynson et al.
patent: 3588777 (1971-06-01), Schroen
patent: 3728176 (1973-04-01), Osborne et al.
patent: 3849276 (1974-11-01), Greiner
patent: 3852795 (1974-12-01), Ames
patent: 3988823 (1976-11-01), Hu
patent: 3988824 (1976-11-01), Bodway

Affiliated with

Also associated with

Rating

Process for fabricating above and below ground plane wiring on o does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for fabricating above and below ground plane wiring on o, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for fabricating above and below ground plane wiring on o will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1668202