Process for fabricating a substrate

Details Process for fabricating a substrate Process for fabricating a substrate

2006-03-21

2006-03-21

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S830000, C029S831000, C029S852000, C174S255000, C174S262000, C427S250000, C427S255700

Reexamination Certificate

active

07013560

ABSTRACT:
A substrate comprises at least a semi-finished substrate, a circuit line, a contact and a solder mask layer. The circuit line and the contact are formed on the semi-finished substrate. The circuit line and the contact are connected together non-integrally. The solder mask layer is formed over the semi-finished substrate to cover the circuit line. The solder mask layer has an opening in which the contact is formed.

REFERENCES:
patent: 5745984 (1998-05-01), Cole et al.
patent: 6931724 (2005-08-01), Rokugawa et al.

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