Process for fabricating a semiconductor package and...

Details Process for fabricating a semiconductor package and... Process for fabricating a semiconductor package and...

2008-04-15

2008-04-15

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S677000

Reexamination Certificate

active

10827612

ABSTRACT:
A semiconductor package includes a flat metal leadframe including spaced apart portions, at least some of which constitute electrical connection leads. A filling material fills the spaces that separate the spaced apart portions of the leadframe to form a plate before fastening an integrated circuit chip to the front of the leadframe. Electrical connections are made between the chip and the electrical connection leads. The chip is then encapsulated on the front of the leadframe using a formed or attached encapsulant.

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Preliminary French Search Report, FR 03 05263, dated Jan. 21, 2004.

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