Process for fabricating a semiconductor package

Details Process for fabricating a semiconductor package Process for fabricating a semiconductor package

2011-04-12

2011-04-12

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S108000, C438S610000, C438S612000, C257SE23018

Reexamination Certificate

active

07923289

ABSTRACT:
A process for fabricating a semiconductor package which includes using an exothermically active nanoparticle paste to join an electrode of a semiconductor die to a support body.

REFERENCES:
patent: 6624522 (2003-09-01), Standing et al.
patent: 2004/0245648 (2004-12-01), Nagasawa et al.
patent: 2008/0260941 (2008-10-01), Jin

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