Semiconductor device manufacturing: process – Gettering of substrate
Reexamination Certificate
2006-11-14
2006-11-14
Kebede, Brook (Department: 2823)
Semiconductor device manufacturing: process
Gettering of substrate
C438S583000, C257SE21318
Reexamination Certificate
active
07135386
ABSTRACT:
By removing halogen atoms existing on the surface of the silicon layer and in the subsurface thereof so that the concentration of halogen atoms becomes 100 ppm or lower and forming an electrode on the resulting silicon layer, the electrode which has a low resistance can be produced, and a highly reliable semiconductor device can be produces as well.
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Iwata Hiroshi
Kataoka Kotaro
Nakano Masayuki
Birch, Stewart, Kolasch and Birch LLP
Kebede Brook
Sharp Kabushiki Kaisha
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