Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1990-09-28
1993-01-05
Lowe, James
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
264 61, C04B 3700
Patent
active
051767724
ABSTRACT:
A process for fabricating a multilayer ceramic circuit board which includes the steps of (i) providing a sintered ceramic substrate having optionally formed via holes already filled with a conductive paste or a conductive substance, (ii) optionally applying an insulating paste layer in a prescribed pattern on one side or each side of the ceramic substrate, (iii) then, providing a ceramic green tape and forming via holes in the green tape, (iv) applying a conductive paste to form a conductive pattern on one side of the green tape, (v) laminating the green tape to one side or each side of the ceramic substrate so that the conductive pattern of the green tape faces the substrate, (vi) optionally pressing and heating the laminate from step (v), and (vii) applying a conductive paste to form a conductive pattern on the other side of the green tape and filling the via holes of the green tape with a conductive paste, before or after step (v).
REFERENCES:
patent: 4478884 (1984-10-01), Barnes et al.
patent: 4645552 (1987-02-01), Vitriol et al.
patent: 4799984 (1989-01-01), Rellick
patent: 4883705 (1989-11-01), Kawakami et al.
patent: 5028473 (1991-07-01), Vitriol et al.
IMC 1982 Proceedings, May 24-26, 1982, Tokyo, Japan, pp. 388-393, N. Kamehara et al., "Packaging Material For High Speed Computers".
Asahi Glass Company Ltd.
Fiorilla Christopher A.
Lowe James
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