Telecommunications – Transmitter and receiver at same station
Patent
1991-10-08
1993-08-24
Eisenzopf, Reinhard J.
Telecommunications
Transmitter and receiver at same station
455333, H04B 138
Patent
active
052396851
ABSTRACT:
The substrate for implementation of MMIC devices comprises alumina with feedthrough holes drilled therein to provide conduct ion paths from the top surface of the substrate to the bottom surface. A high-temperature to low-temperature fabrication process is used to form circuit traces and components upon the substrate. Each of the thick film deposition processes is followed by a firing process to remove organic materials from the deposited material and to secure the material to the substrate or previous layer. A Ku-band transceiver constructed using the process includes the attachment of six discrete, unpackaged MMIC's and one HEMT. All other devices and traces are patterned on the substrate and the discrete components are directly attached to pads on the substrate.
REFERENCES:
patent: 4016493 (1977-04-01), Gross
patent: 4383273 (1983-05-01), Lunn
patent: 4384367 (1983-05-01), King et al.
patent: 4495648 (1985-01-01), Giger
"Thick Film Techniques for Microwave Intergrated Circuits" by Ted M. Foster et al. IEEE Transaction on Parts, Hybrids and Packaging, vol. PHP-10, No. 2, Jun. 1974, pp. 88-94
"Thin-Film Design Guidelines for Microwave Circuitry" by Michael D. Casper, Microwave Journal, Oct. 1988, pp. 129-131.
"Ku-Band MMIC Upconverter for Mobile Satellite Communications" by Douglas L. Dunn et al, GaAs IC Symposium, pp. 271-273.
"Advance Product Information and Technical Brief" brochure relating to Ku-Band DBS MMIC Downconverter, Anadigics, Inc.
"Thin Film Substrate Standards and Specifications" by Coors Ceramic Company.
"Fujitsu Super Low Noise Hemt-FHX Series" Preliminary Specification.
NEC 14GHz Divide-by-8 Prescaler Preliminary, pp. 5-1 to 5-4.
Electro-Science Laboratories, Inc. Dielectric Composition Specification Sheet.
"Electro-Science Laboratories, Inc. Palladium-Silver Metalization and Conductive Coatings", Bulletin No. 92278.
"Electro-Science Laboratories, Inc. #9638 Pd/Ag Conductor" Specification Sheet.
DuPont Birox Thick Film Resistor Compositions--Series 17 Resistor Compositions Specification Sheet.
EMCA-REMEX Products Capacitor Overglaze 7527 Technical Information.
DuPont Thick Film Conductor Compositions, Gold Conductor Compositions 5715, Microcircuit and Multilayer Interconnect Hybrids.
Bruckner Clarence L.
Dewey Richard C.
Dunn Douglas L.
Moe Douglas H.
Eisenzopf Reinhard J.
Keough Timothy H.
Miller Russell B.
Qualcomm Incorporated
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