Process for fabricating a microtip cathode assembly for a field

Details Process for fabricating a microtip cathode assembly for a field Process for fabricating a microtip cathode assembly for a field

1996-12-13

1999-12-14

Ramsey, Kenneth J.

Electric lamp or space discharge component or device manufacturi

Process

With assembly or disassembly

H01J 902

Patent

active

060009802

ABSTRACT:
A process for forming a microtip cathode structure on a field emission display panel which avoids the need of vacuum depositing a lift-off layer for the microtip deposition overstructure in specially equipped reactors to accomplish a deposition at a grazing angle, by co-patterening the lift-off layer together with an underlying metal grid layer using a succession of different etching steps through the openings of a grid definition mask. According to an embodiment, nickel is used as lift-off material and is either wet-etched or sputter-etched before performing a plasma etch of the underlying grid metal layer. According to an alternative embodiment, the masking resist layer is used as lift-off material.

REFERENCES:
patent: 5739628 (1998-04-01), Takada

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