Process for fabricating a Josephson device

Coating processes – Electrical product produced – Superconductor

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427 62, 427404, 505817, 505832, 505874, 257 34, 257 35, H01L 3900

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054015308

ABSTRACT:
A process for producing a Josephson device is disclosed, wherein a Josephson junction is formed over a recess step by oblique deposition and a protective layer of conducting material or semiconducting material is formed on the Josephson junction. The actual thickness of the Josephson junction is controlled to be smaller due to the proximity effect.

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Werner Buckel, Supraleitung, Grundlagen und Anwendungen, 2, Auflage, Physik Verlag, Weinheim 1977; pp. 282-286.
"Improved Fabrication Method of the Microbridge Utilizing Step Edge", Japanese Journal of Applied Physics, vol. 25, No. 7, Jul. 1986, pp. 1006-1010, Nakanishi et al.
"Extension of the bi-epitaxial Josephson junction process to various substrates", Colclough et al., 1991 Amer. Institute of Physics, Oct. 21, 1991, pp. 2177-2179.
"Practical high T.sub.c Josephson junctions and dc SQUIDs operating above 85 K," Yoshizumi et al., 1991 Amer. Institute of Physics, Jun. 3, 1991, pp. 2552-2554.
DC Squid with Variable Thickness Bridge, Physics B 165 & 166 (1990) pp. 78-80 North-Holland.
Fujita et al, "Fabrication of V.T.B type dc-SQUID (II) control the length of the weak bond portion by the angle of evaporation", 37th Japan Society of Applied Physics and related Societes (Mar. 28, 1990) Translation pp. 1-2.

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