Process for fabricating a high-integration-density image sensor

Details Process for fabricating a high-integration-density image sensor Process for fabricating a high-integration-density image sensor

2011-08-23

2011-08-23

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S063000, C438S064000, C257SE27141

Reexamination Certificate

active

08003433

ABSTRACT:
The present application relates to the fabrication of an electronic component. The component comprises two, superposed integrated circuits: one of which is formed on the front side of a thinned first substrate, and the other of which is produced on the front side of a second substrate, with an insulating planarization layer interposed between the front sides of the two substrates. The silicon of the backside of the thinned substrate is opened locally above a first conducting area located in the thinned substrate and above a second conducting area located in the second substrate. A conducting layer portion, deposited on both areas, electrically connects them so as to provide the interconnection between the two circuits. The external connection pads may also be formed in this conducting layer.

REFERENCES:
patent: 6809008 (2004-10-01), Holm et al.
patent: 2005/0035381 (2005-02-01), Holm et al.
patent: 2005/0040316 (2005-02-01), Holm et al.
patent: 2005/0247940 (2005-11-01), Shibata et al.
patent: 2006/0043438 (2006-03-01), Holm et al.
patent: 2006/0197007 (2006-09-01), Iwabuchi et al.
patent: 2007/0166956 (2007-07-01), Blanchard
patent: 2008/0290438 (2008-11-01), Weng et al.
patent: 2009/0224161 (2009-09-01), Fritsch et al.
patent: 2009/0263931 (2009-10-01), Blanchard
patent: 2010/0314776 (2010-12-01), Blanchard

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