Process for fabricating a high density multi-layer microcoil

Details Process for fabricating a high density multi-layer microcoil Process for fabricating a high density multi-layer microcoil

2007-03-27

2007-03-27

Kim, Paul D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S592100, C029S602100, C029S605000, C029S846000, C216S039000, C216S041000, C257S531000, C336S065000, C336S083000, C336S200000, C336S206000, C336S220000, C336S232000, C438S106000, C438S107000, C438S238000, C438S381000

Reexamination Certificate

active

10827375

ABSTRACT:
A high density multi-layer microcoil includes a substrate, a multi-layer coil winding, a magnetic core and a dry film photoresist structure. The multi-layer coil winding and the magnetic core are supported by the dry film photoresist structure. The fabrication process is using photolithography process to form a dry film photoresist structure with a coil tunnel having coil elements perpendicular to the substrate and two outlets at ends of the tunnel; and injecting a conductive material with a low melting point into the tunnel and forming the coil winding.

REFERENCES:
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patent: 5852866 (1998-12-01), Kuettner et al.
patent: 6015742 (2000-01-01), Ju
patent: 6429764 (2002-08-01), Karam et al.
patent: 6441715 (2002-08-01), Johnson
patent: 6600404 (2003-07-01), Kajino
“Novel Fabrication Of Electroplated 3D Micro-Coils Using 3D Photolithography Of Thick Photoresist”; Yoon, J.-B.; Han, C.-H.; Yoon, E.-S.; Kim, C.-K.; Microprocesses and Nanotechnology Conference, 1998 International; Jul. 13-16, 1998; pp. 85-86.

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