Process for exposing a peripheral area of a wafer and a device f

Photocopying – Projection printing and copying cameras – Step and repeat

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355 67, G03B 2742, G03B 2754

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active

059299762

ABSTRACT:
A process for exposing the peripheral area of a wafer and a device for executing the process is provided to enable both step-shaped exposure and also ring-shaped exposure of part of the peripheral area of a wafer using a single arrangement. The device includes a rotary carrier for receiving a wafer having resist thereon, which is moved and rotated based on the position of the wafer on the carrier, the position of a singular point formed on an edge of the wafer, such as an "ori-fla" and the like, and furthermore alignment mark position information, to position the wafer in a stipulated position. Then, using an X-Y carrier, the rotary carrier is moved as exposure light is radiated from a first exit part to expose some of the peripheral area of the wafer in a step shape. Next, the rotary carrier is moved again and rotated, and exposure light emitted from a second exit part to expose a not yet exposed part of the peripheral area of the wafer in a ring-shape. A fiber changeover unit may be positioned and the exposure light introduced into an exit part from a single light source.

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patent: 5229811 (1993-07-01), Hattori et al.
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patent: 5359389 (1994-10-01), Isohata
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Patent Abstracts of Japan, vol. 17, No. 104 (E-1328), Mar. 3, 1993, & JP 04 291914 A (USHIO Inc.), Oct. 16, 1992, * Abstract * .
Patent Abstracts of Japan, vol. 14, No. 444 (E-0982), Sep. 21, 1990 & JP 02 177420 A (USIO Inc.), Jul. 10, 1990, * Abstract * .

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