Process for etching N, P, N+ and P+ type slugs and wafers

Details Process for etching N, P, N+ and P+ type slugs and wafers Process for etching N, P, N+ and P+ type slugs and wafers

1996-12-23

1998-12-01

Breneman, R. Bruce

Etching a substrate: processes

Nongaseous phase etching of substrate

With measuring, testing, or inspecting

438 16, 216 99, B44C 122

Patent

active

058433228

ABSTRACT:
A process for etching single crystal silicon semiconductor material of the N, P, N+ and P+ type slugs and wafers to delineate slip, lineage, dislocation, S-pit, twins, swirl and oxidation induced stacking fault defects involves the steps of:

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Thomas C. Chandler, Jr., An Investigation into the Development of Etchants for the Delineation of Structural Imperfections by Pit or Hillock Formation (1993).

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