Process for etching a metal oxide coating and simultaneous depos

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437101, 437228, 156667, 156643, 156646, 2041921, 20419229, 2041923, 20419232, 20419235, H01L 2128, H01L 21336

Patent

active

050791788

ABSTRACT:
The process of the invention consists of subjecting a metal oxide coating (106, 108), located on a glass substrate (100), to the action of a gaseous plasma (109) containing 10 to 88% by volume of hydrogen, 2 to 30% by volume of a hydrocarbon and 10 to 50% of an inert vector gas, bringing about the formation of a polymer coating (110) on the parts of the substrate not provided with oxide, by dissocation of the gaseous mixture, and the partial chemical etching of the oxide (106, 108) by the formation of organometallic compounds.

REFERENCES:
patent: 3957609 (1976-05-01), Sasano et al.
patent: 3979240 (1976-09-01), Ghezzo
patent: 4069094 (1978-01-01), Shaw et al.
patent: 4093504 (1978-06-01), Ponjee et al.
patent: 4336295 (1982-06-01), Smith
patent: 4390394 (1983-06-01), Mathuni et al.
patent: 4396458 (1983-08-01), Platter et al.
patent: 4542578 (1985-09-01), Yamano et al.
patent: 4544444 (1985-10-01), Chang
patent: 4625224 (1986-11-01), Nakagawa et al.
patent: 4653858 (1987-03-01), Szydlo et al.
patent: 4654117 (1987-03-01), Aoki et al.
patent: 4665008 (1987-05-01), Nishiura et al.
patent: 4670097 (1987-06-01), Abdalla et al.
patent: 4733284 (1988-03-01), Aoki
patent: 4750980 (1988-06-01), Hynecek
patent: 4778562 (1988-10-01), Chang et al.
patent: 4797108 (1989-01-01), Crowther
patent: 4818981 (1989-04-01), Oki et al.
patent: 4849797 (1989-07-01), Ukai et al.
patent: 4863557 (1989-09-01), Kokaku et al.
patent: 4878993 (1989-11-01), Rossi et al.
patent: 4948706 (1990-08-01), Sugihara et al.
Hosokawa et al., "RF Sputter-Etching by Fluor-Chloro-Hydro-Carbons", 6th Int. Vacuum Congress, Mar. 25-29, 1974, p. 27.
Bradshaw et al., "Etching Methods for Indium Oxide/Tin Oxide Films", Thin Solid Films, vol. 33, No. 2, Apr. 1, 1976, pp. L5-L8.
Sasano et al., "Taper Etching of SnO.sub.2 Films", J. Vac. Soc. Jpn., vol. 24, No. 12, 1981, pp. 653-659.
Braga et al., "Plasma Etching of SnO.sub.2 Films on Silicon Substrates", Thin Solid Films, vol. 73, 1980, pp. L5-L6.
Minami et al., "Reactive Ion Etching of Transparent Conducting Tin Oxide Films Using Electron Cyclotron Resonance Hydrogen Plasma", Jap. J. Appl. Phys., vol. 27, No. 9, Sep. 1988, pp. L1753-L1756.
Henry et al., "Novel Process for Integration of Optoelectronic Devices Using Reactive Ion Etching Without Chlorinated Gas", Electronics Letters, vol. 23, No. 24, Nov. 19th, 1987, pp. 1253-1254.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for etching a metal oxide coating and simultaneous depos does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for etching a metal oxide coating and simultaneous depos, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for etching a metal oxide coating and simultaneous depos will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-822033

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.