Process for enhanced photoresist removal in conjunction with var

Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents

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134 3, 134 33, 134 36, 134 2215, 216 2, B08B 300, B08B 700, C23G 102, C23F 100

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active

058610642

ABSTRACT:
A novel method is disclosed for the removal of organic material, particularly hardened photoresist, from the surface of a substrate. Layers of organic material are removed using at least two treatment cycles, each of which includes the steps of a) applying an acid-containing composition, optionally mixed with an oxidizer, to the substrate surface, and then b) applying water to the substrate surface. The process is characterized by higher temperature spikes, shorter process times and lower chemical usage than is obtained with conventional photoresist stripping methods which do not employ repetitious treatments. The method may be practiced with spray processing equipment.

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