Process for encasing an electronic component

Details Process for encasing an electronic component Process for encasing an electronic component

1989-05-15

1991-06-11

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

204 585, C25D 1100

Patent

active

050229699

ABSTRACT:
The process for encasing an electrically conductive region in an electronic component in an insulating layer comprises the steps of depositing a polymer layer by electrochemical polymerization of phenol-, thiophenol- and analine-containing monomers and their combinations from an electrolytic solution on the electrically conductive region and subsequently cross-linking the polymer layer to form a chemically inert insulating layer. The process provides a uniformly adhering thin insulating layer. A field effect transistor so encased is suitable for use as a physical and/or chemical sensor.

REFERENCES:
patent: 2961384 (1960-11-01), McKinney et al.
patent: 3335075 (1967-08-01), Borman
patent: 4070258 (1978-01-01), McGinniss
patent: 4231851 (1980-11-01), Mengoli et al.
patent: 4369290 (1983-01-01), Evans et al.
patent: 4444627 (1984-04-01), Liau et al.

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