Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-02-28
2006-02-28
Geyer, Scott (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S113000
Reexamination Certificate
active
07005322
ABSTRACT:
Process for fabricating semiconductor components, and semiconductor component, in which a support plate comprises, at various locations, portions provided with respective electrical connection means having electrical connection regions on a front face and having through-holes located in proximity or adjacently to the portions. An integrated-circuit chip is fastened to the front face of each portion of the support plate by means of electrical connection balls. On one side, the electrical connection balls are connected to electrical connection regions of the front face of this plate and, on the other side, to electrical connection pads on the rear face of this integrated-circuit chip, in positions such that one edge of the rear face of each integrated-circuit chip faces at least one through-hole. A curable liquid fill material is delivered in the through-holes so as to at least partly fills a space defined between this support plate and each integrated-circuit chip, respectively.
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Fleit Kain Gibbons Gutman Bongini & Bianco P.L.
Geyer Scott
Gibbons Jon A.
Jorgenson Lisa K.
STMicroelectronics S.A.
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