Process for encapsulating radioactive organic liquids in a resin

Compositions – Radioactive compositions

Patent

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252631, 264 05, G21F 916

Patent

active

044055129

ABSTRACT:
A cured resin system is used to encapsulate certain liquid low level radioactive wastes which are solvents for or are soluble in the uncured resin and which are more soluble in water than in the uncured resin. The process comprises the dilution of said waste with water to an extent that the amount of waste that will partition in the uncured resin system is less than the amount that will retard the cure rate of the system or that will adversely affect physical properties of the cured product, followed by the uniform dispersion of the aqueous solution in said curable resin system after which the resin system is cured to a solid with the aqueous waste solution dispersed therein.

REFERENCES:
patent: 3256219 (1966-07-01), Will
patent: 3463738 (1969-08-01), Fitzgerald et al.
patent: 4009116 (1977-02-01), Bahr et al.
patent: 4077901 (1978-03-01), Arnold et al.
patent: 4131563 (1978-12-01), Bahr et al.

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