Process for encapsulating electronic components in plastic

Details Process for encapsulating electronic components in plastic Process for encapsulating electronic components in plastic

1973-07-30

1977-08-23

Tupman, W.

Metal working

Method of mechanical manufacture

Assembling or joining

264272, B01J 1700

Patent

active

040430278

ABSTRACT:
A method of making a semiconductor device is disclosed in which a plurality of generally parallel conductors are provided, at least one of which has a mounting portion thereon. A semiconductor wafer is coupled to the mounting portion while means are provided for coupling the other conductors to the semiconductor wafer. An integrally molded mass of insulation material embeds the semiconductor wafer, and the mounting portion, as well as the means connecting the conductors to the semiconductor wafer.

REFERENCES:
patent: 2436597 (1948-02-01), Otis
patent: 3221089 (1965-11-01), Cotton
patent: 3367025 (1968-02-01), Doyle

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