Process for encapsulating articles with optional laser printing

Coating processes – Electrical product produced – Welding electrode

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Details

427 79, 427 96, 427101, 4273981, 430286, B05D 306, B05D 512

Patent

active

045605807

ABSTRACT:
Articles, such as electrical circuits or elements, are encapsulated by melting polyarylene sulfide in combination with at least one print compound such as monazo-nickel complex, lead chromate-lead molybdate, quinacridone, Ni--Sb--Ti, Co--Zn--SiO.sub.2 or lead chromate, injecting this molten composition around the article to be encapsulated, and cooling and solidifying the molten composition. The articles may latter be laser printed.

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Plastics World, Mar. 1979, pp. 58-61, "Additives-1979".
Plastics World, Jul. 1977, pp. 44-47, "Additives for Plastics-1977".
Series 920 Data "Laser Mark" from Lumonics, Canada Laser Marking System.

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