Process for encapsulating an electronic component

Details Process for encapsulating an electronic component Process for encapsulating an electronic component

1995-12-29

1999-04-20

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

Mechanical shaping or molding to form or reform shaped article

To produce composite, plural part or multilayered article

26427217, B29C 4514, B29C 7070

Patent

active

058956204

ABSTRACT:
Process for encapsulating an electronic component, in particular an integrated circuit, with an encapsulating material, at least comprising the steps of:

REFERENCES:
patent: 3911075 (1975-10-01), Boesch et al.
patent: 3969461 (1976-07-01), Boesch et al.
patent: 4327369 (1982-04-01), Kaplan
patent: 4370292 (1983-01-01), Yanase et al.
patent: 4853442 (1989-08-01), Nguyen
patent: 4972031 (1990-11-01), Choate et al.
patent: 5277864 (1994-01-01), Blatz
patent: 5326516 (1994-07-01), Brannon
patent: 5364914 (1994-11-01), Choate et al.
patent: 5443775 (1995-08-01), Brannon

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