Process for encapsulating a semiconductor device and lead frame

Details Process for encapsulating a semiconductor device and lead frame Process for encapsulating a semiconductor device and lead frame

1995-10-19

1997-09-09

Graybill, David E.

Metal working

Method of mechanical manufacture

Electrical device making

438123, 438124, H01L 2156, H01L 2158, H01L 2160

Patent

active

056656513

ABSTRACT:
Outer leads are buried in a package. At least the contact portions of the outer leads which are connected to a circuit board are exposed from the package and the exposed portions make the same flat surfaces as the package surface. When forming the package, the outer leads are used as the side wall of a mold forming mold, and therefore, they are formed thicker than inner leads inside the package. Thus, the package thickness can be made equal to the thickness of the outer leads.

REFERENCES:
patent: 4660127 (1987-04-01), Gunter
patent: 5134458 (1992-07-01), Tsutsumi et al.
patent: 5134773 (1992-08-01), LeMaire et al.
patent: 5299092 (1994-03-01), Yaguchi et al.

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