Process for encapsulating a semiconductor chip, leadframe and he

Details Process for encapsulating a semiconductor chip, leadframe and he Process for encapsulating a semiconductor chip, leadframe and he

1992-08-12

1995-01-24

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437214, 437217, 26427217, 257675, 257717, 257796, H01L 2152, H01L 2156, H01L 2158, H01L 2160

Patent

active

053842863

ABSTRACT:
A method mold for producing a semiconductor device having a heat-sinking plate and a leadframe. The heat-sinking frame and leadframe are precisely positioned on a lower mold with cooperating positioning holes and pins with a space between the heat-sinking frame and the leadframe. After an upper mold is clamped to the lower mold, resin is injected into a cavity in the mold to encapsulate the leadframe to which a semiconductor chip is attached and the heat-sinking plate into one body.

REFERENCES:
patent: 3659821 (1972-05-01), Sakamoto et al.
patent: 3778887 (1973-12-01), Suzuki et al.
patent: 4043027 (1977-08-01), Birchler et al.
patent: 4680617 (1987-07-01), Ross

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