Process for electroplating tin, lead and tin-lead alloys and bat

Chemistry: electrical and wave energy – Processes and products

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204 53, 204 54R, C25D 332, C25D 336, C25D 356, C25D 360

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active

045991499

ABSTRACT:
This invention relates to the electrodeposition of tin, lead and particularly tin-lead alloys from an electroplating bath comprising a lead and/or tin alkylsulfonate, and alkylsulfonic acid in a sufficient amount to impart a pH below about 3 to the bath, and various additives to improve the brightness of the deposits, the useful current density ranges, and/or the solderability of tin-lead alloy deposits including quaternary nitrogen wetting agents containing a fatty acid radical, alkylene oxides, pyridine compounds, aromatic aldehydes, acetaldehyde and/or a bismuth compound. The bath is formulated to have a cloud point above about 90.degree. F.

REFERENCES:
patent: 2525942 (1950-10-01), Proell
patent: 3663384 (1972-05-01), Lescure
patent: 3905878 (1975-09-01), Dohi et al.
patent: 4000047 (1976-12-01), Ostrow et al.
patent: 4132610 (1979-01-01), Dohi et al.
patent: 4384930 (1983-05-01), Eckles
patent: 4388158 (1983-06-01), Inui et al.
patent: 4459185 (1984-04-01), Obata et al.
Dohi et al., "Bright Solder and Indium Plating from Methane Sulfonic Acid", Proceeding of Electroplating Seminar, Jul. 1978.

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