Process for electroplating nonconductive surface

Details Process for electroplating nonconductive surface Process for electroplating nonconductive surface

1995-03-15

1996-08-20

Bell, Bruce F.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205159, 205162, 205163, 205164, 205165, 205166, 205183, 205188, C25D 502, C25D 554, C25D 556, C23C 2800

Patent

active

055475582

ABSTRACT:
The invention relates to a process for directly electroplating a conductive metal to the inner walls of through-holes in printed-wiring boards. The process comprises steps of providing an aqueous dispersion containing graphite particles with an average particle diameter of 2 .mu.m or less or carbon black particles with an average particle diameter of 1 .mu.m or less; applying this aqueous dispersion to a surface of a nonconductive surface substrate; dipping the nonconductive surface in a strong acidic aqueous solution with pH 3 or lower to form a layer of said particles; and electroplating using the particle layer as a conductive layer.

REFERENCES:
patent: 4035265 (1977-07-01), Saunders
patent: 5015339 (1991-05-01), Pendleton
patent: 5389270 (1995-02-01), Thorn et al.

Affiliated with

Also associated with

Rating

Process for electroplating nonconductive surface does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for electroplating nonconductive surface, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for electroplating nonconductive surface will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2328061