Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...
Reexamination Certificate
2005-09-20
2005-09-20
King, Roy (Department: 1742)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal or alloy coating on...
C205S103000, C205S104000, C205S118000, C205S123000, C205S149000, C205S157000, C205S186000, C205S187000
Reexamination Certificate
active
06946065
ABSTRACT:
Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling.
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Bhaskaran Vijay
Jackson Robert L.
Mayer Steven T.
Patton Evan E.
Reid Jonathan
Beyer Weaver & Thomas LLP.
King Roy
Leader William T.
Novellus Systems Inc.
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