Process for electrolytically plating copper

Details Process for electrolytically plating copper Process for electrolytically plating copper

2006-04-05

2009-08-18

Nguyen, Nam X (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

C205S210000

Reexamination Certificate

active

07575666

ABSTRACT:
An electrolytic copper plating process comprising two steps is proposed. The process is particularly suited to plating in very confined spaces. The first step comprises a pre-treatment solution comprising an anti-suppressor that comprises a sulfur containing organic compound, preferably incorporating an alkane sulfonate group or groups and/or an alkane sulfonic acid. The second step comprises an electrolytic copper plating solution based on an alkane sulfonic acid.

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