Process for electrolessly plating copper and plating solution th

Details Process for electrolessly plating copper and plating solution th Process for electrolessly plating copper and plating solution th

1988-05-06

1990-06-19

Beck, Shrive

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

427305, 427 98, B05D 118

Patent

active

049352679

ABSTRACT:
By forming a first copper layer on a substrate by using a complexing agent for copper ion, which has a low copper complex stability constant, a uniform second layer can be stably formed by a second complexing agent for a copper ion, which has a high copper complex stability constant, even if the substrate is composed of a material having a low catalytic activity, such as tungsten, or even if the catalytic activity of the substrate is uneven. A similar effect can also be obtained by adding a small amount of a complexing agent for a copper ion, having a low stability constant, to an electroless copper plating bath containing a complexing agent for a copper ion, having a low stability constant. In this case, an effect of preventing stopping of the reaction of the complexing agent of a copper ion, having a high stability constant, is attained. Most preferably, after formation of a uniform first copper layer by an electroless copper plating solution containing a complexing agent for a copper ion, having a low stability constant, a second copper layer is formed by an electroless copper plating solution containing a complexing agent for a copper ion, having a high stability constant and also in this case, a small amount of a complexing agent for a copper ion, having a low stability constant, is added.

REFERENCES:
patent: 3645749 (1972-02-01), Paunovic
patent: 3650777 (1972-03-01), Schneble
patent: 4066809 (1978-01-01), Alpaugh
patent: 4169171 (1979-09-01), Narcus
patent: 4265943 (1981-05-01), Goldstein et al.
patent: 4301196 (1981-11-01), McCormack et al.
patent: 4391841 (1983-07-01), Zeblisky
patent: 4525390 (1985-01-01), Alpaugh et al.
patent: 4650691 (1987-03-01), Kinoshita et al.
patent: 4834796 (1989-05-01), Kondo

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