Process for electroless plating using colloid sensitization and

Details Process for electroless plating using colloid sensitization and Process for electroless plating using colloid sensitization and

1975-08-15

1977-02-15

Kendall, Ralph S.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427306, 427 98, B05D 310

Patent

active

040083438

ABSTRACT:
A process is described for the electroless deposition of metals on nonmetallic surfaces. The process involves pretreatment of the nonmetallic surface so as to obtain a surface finish suitable for deposition of colloidal sensitizers which catalyze electroless metallic deposition. The nonmetallic surface is then exposed to a colloidal catalyst solution (typically SnCl.sub.2 /PdCl.sub.2) followed by an acid rinse. On completion of this surface activation procedure, the surface is exposed to a bath for the electroless deposition of metal. This procedure, which differs from that traditionally used, insures more reliable catalysis for electroless deposition of metals with shorter initiation times and is simpler in procedure and lower in cost.

REFERENCES:
patent: 3011920 (1961-12-01), Shipley, Jr.
patent: 3532518 (1970-10-01), D'Ottavio
patent: 3562038 (1971-02-01), Shipley, Jr. et al.
patent: 3767583 (1973-10-01), Fadgen, Jr. et al.

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