Process for electroless plating tin, lead or tin-lead alloy

Details Process for electroless plating tin, lead or tin-lead alloy Process for electroless plating tin, lead or tin-lead alloy

1992-02-28

1993-09-28

Beck, Shrive

Coating processes

Immersion or partial immersion

Metal base

4274431, 427304, 427 8, C23C 200

Patent

active

052485277

ABSTRACT:
The invention provides a process for electroless plating tin, lead or tin-lead alloy on copper or copper alloy using an electroless plating bath containing a water soluble tin and/or lead salt, an acid capable of dissolving the salts, and a complexing agent. The tin and/or lead content in the bath is maintained high enough to chemically deposit thick films by replenishing the tin and/or lead salt in proportion to an increase in concentration of copper ion dissolving out in the bath. Also provided is an electroless tin, lead or tin-lead alloy plating process in which a water soluble copper salt is added to a fresh bath.

REFERENCES:
patent: Re30434 (1980-11-01), Davis
patent: 2230602 (1941-02-01), Sullivan
patent: 4093466 (1978-06-01), Davis
patent: 4194913 (1980-03-01), Davis
patent: 5143544 (1992-09-01), Iantosca
A. H. Du Rose "The Protective Value of Lead and Lead-Tin Deposits on Steel" The Electrochemical Society Preprint 89-7 Apr., 1946, pp. 101-112.
Abstract 3-59642 of Japanese Patent Application Kokai No. 3-59642.
Abstract 1-184279 of Japanese Patent Application Kokai No. 1-184279.

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