Process for electroless metal deposition

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 98, 427304, 427305, 427306, B44D 114

Patent

active

047013508

ABSTRACT:
Disclosed herein are processes for the electroless (chemical) plating of substrates incorporating polyelectrolytes to increase the catalytic site density prior to the electroless (chemical) metal deposition step.

REFERENCES:
patent: 3175964 (1965-03-01), Watanabe
patent: 3421922 (1969-01-01), Wilson
patent: 3563784 (1971-02-01), Innes
patent: 3702285 (1972-11-01), Knorre
patent: 3899617 (1975-08-01), Courdueelis
patent: 4077853 (1978-03-01), Coll et al.
patent: 4089993 (1978-05-01), Shirahata
patent: 4217182 (1980-08-01), Cross
patent: 4244789 (1981-01-01), Coll et al.

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