Process for electroless copper plating and apparatus used theref

Details Process for electroless copper plating and apparatus used theref Process for electroless copper plating and apparatus used theref

1988-06-13

1989-09-12

Beck, Shrive

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

118410, 118429, 118600, B05D 118

Patent

active

048658880

ABSTRACT:
An electroless copper plating process for producing fine patterned wiring boards is improved by supplying very fine oxygen-containing gas bubbles through a porous alkali-resistant resin gas dispersing tube. An electroless copper plating apparatus having such a gas dispersing tube is also provided.

REFERENCES:
patent: 2938805 (1960-05-01), Agens
patent: 4152467 (1979-05-01), Alpaugh
patent: 4158076 (1979-06-01), Wallsten

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