Process for electro-depositing composite nickel layers

Details Process for electro-depositing composite nickel layers Process for electro-depositing composite nickel layers

1981-07-06

1983-05-24

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 43T, 204 49, C25D 512

Patent

active

043849296

ABSTRACT:
An improved composition and process for producing a composite nickel-containing electroplate on a substrate including an inner nickel-containing layer of an average sulfur content of less than about 0.03 percent by weight, an intermediate nickel-containing layer of an average sulfur content of about 0.05 to about 0.5 percent by weight and an adjacent adherent outer nickel layer of an average sulfur content of about 0.02 to about 0.15 percent but less in sulfur than the intermediate layer and higher in sulfur than the inner layer. The controlled amount of sulfur is introduced into at least the intermediate layer by employing an aqueous acidic nickel solution containing a controlled amount of a thiazole compound so as to provide an intermediate nickel-containing deposit containing the specified average sulfur content.

REFERENCES:
patent: 3090733 (1963-05-01), Brown
patent: 3795591 (1974-03-01), Clauss et al.
patent: 3857765 (1974-12-01), Merker et al.

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