Process for DRAM incorporating a high-energy, oblique P-type imp

Fishing – trapping – and vermin destroying

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437 52, 437 60, 437 44, 437 27, 437919, H01L 21265

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054398355

ABSTRACT:
This invention is a process for fabricating a CMOS dynamic random access memory (DRAM) wherein a high-energy, oblique P-type implant is employed for punchthrough protection and field isolation enhancement or alternatively for punchthrough protection and as the sole field isolation implant. The process proceeds by forming P-type and N-type regions in a silicon substrate, performing an optional field isolation implant and forming field isolation regions using LOCOS or a modified LOCOS sequence, forming a gate dielectric layer, forming wordlines, depositing an offsetting dielectric layer, performing a low-dosage N-type implant in N-channel source/drain regions, forming spacers on the sidewalls of the gate electrodes, constructing cell capacitors superjacent the storage-node regions, performing a high-energy oblique implant with a P-type impurity which penetrates the spacers and field oxide layers, and performing a high-dosage N-type implant in bitline contact regions. As an option, the angle of the P-type oblique implant is varied through a given range to create an anti-punchthrough halo having a graded density. As a further option, a lower energy oblique implant may be performed with an N-type implant to create a graded junction for bitline junction region.

REFERENCES:
patent: 5198386 (1993-03-01), Gonzalez
patent: 5217910 (1993-06-01), Shimizu et al.
patent: 5245208 (1993-09-01), Eimori
patent: 5250449 (1993-10-01), Kuroyanagi et al.
patent: 5292674 (1994-03-01), Okabe et al.
patent: 5312768 (1994-05-01), Gonzalez
patent: 5334547 (1994-08-01), Nakamura
patent: 5338955 (1994-08-01), Tamura et al.
patent: 5376566 (1994-12-01), Gonzalez
Hori et al., "Deep-Submicrometer Large-Angle-Tilt Implanted Drain (LATID) Technology" IEEE Transactions on Electron Devices, vol. 39, No. 10, Oct. 1992.
A New Subicron MOSFET with LATID (Large-Tilt Angle Implanted Drain) Structure Takashi Hori, Kazumi Kurimoto, Toshiki, Yabu, and Genshu Fuse pp. 15 & 16.
Mechanism Analysis of a Highly Reliable Graded Junction Gate/N Overlapped Structure in MOS LDD Transistor Y. Okumura, T. Kunikiyo, I Ogoh, H. Genjo, M. Inuishi, M. Nagatomo and T. Matsukawa, pp. 477-480, 1989.
Angled Implant Fully Overlapped LDD (AI-Fold) NFET's for Performance and Reliability. A Bryant, T. Furukawa, J. Mandelman, S. Mittl, W. Noble, E. Nowak, W. Wade, S. Ogura & M. Wordeman. pp. 152-157. 1989.
Drain-Structure Design for Reduced Band-to Band and Band-to-Defect Tunneling Leakage. Takashi Hor. pp. 69-70. 1990.
SCC (Scurrounded Capacitor Cell) Structure for DRAM. G. Fuse, K. Tateiwa, S. Odanaka, T. Yamada, I. Nakao, H. Shimoda, O. Shippou, M. Fukumoto, J. Yasui, Y. Naito, and T. Ohzone. pp. 11-14. 1987.
1/4-PM LATID (Large-Tilt-angle Implanted Drain) Technlogy for 3.3-V Operation. Takashi Horo. pp. 32.4.1-32.4.4. 1989.
Deep-Submicrometer Large-Angle-Tilt Implanted Drain (LATID) Technology Takashi Hori, Junji Hirase, Yoshinori Odake & Takatoshi Yasui. pp. 2313-2324. 1992.
Optimum Design of Gate/N Overlapped LDD Transistor. M. Inuishi, K. Mitsui, S. Komori, M. Shimizu, H. Oda, J. Mitsuhashi & K. Tsukamoto. pp. 4-4-4-5.
A New MOSFET with Large-Tilt-Angle Implanted Drain (LATID) Structure. Takashi Hori, Kazumi Kurimoto 1988.

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