Process for dissipating heat from a semiconductor package

Details Process for dissipating heat from a semiconductor package Process for dissipating heat from a semiconductor package

1993-10-28

1996-02-06

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, 174262, 174261, 361770, H05K 111

Patent

active

054897521

ABSTRACT:
A dam is provided on a surface of a circuit board to which an integrated circuit device is to be mounted. The dam defines a region between the integrated circuit package and the circuit board, and a material is injected into this region after the device has been mounted on the circuit board. This material preferably is a good thermal conductor, assisting in the removal of heat from the device. The injected material also preferably acts as an adhesive, more firmly bonding the device the circuit board.

REFERENCES:
patent: 3991347 (1976-11-01), Hollyday
patent: 4644445 (1987-02-01), Sakuma
patent: 5226748 (1993-11-01), Kawakami et al.

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