Process for dissipating heat from a semiconductor package

Details Process for dissipating heat from a semiconductor package Process for dissipating heat from a semiconductor package

1995-05-24

1997-01-07

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 174 522, 437211, H05K 334

Patent

active

055904629

ABSTRACT:
A dam is provided on a surface of a circuit board to which an integrated circuit device is to be mounted. The dam defines a region between the integrated circuit package and the circuit board, and a material is injected into this region after the device has been mounted on the circuit board. This material preferably is a good thermal conductor, assisting in the removal of heat from the device. The injected material also preferably acts as an adhesive, more firmly bonding the device the circuit board.

REFERENCES:
patent: 3991347 (1976-11-01), Hollyday
patent: 4143456 (1979-03-01), Inoue
patent: 4396936 (1983-08-01), McIver et al.
patent: 4483067 (1984-11-01), Permentier
patent: 4644445 (1987-02-01), Sakuma
patent: 5008213 (1991-04-01), Kolesar, Jr.
patent: 5266748 (1993-11-01), Kawakami et al.

Affiliated with

Also associated with

Rating

Process for dissipating heat from a semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for dissipating heat from a semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for dissipating heat from a semiconductor package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1756146