Process for disengaging semiconductor die from an adhesive film

Details Process for disengaging semiconductor die from an adhesive film Process for disengaging semiconductor die from an adhesive film

2005-05-10

2005-05-10

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C156S345420, C156S361000, C228S006200

Reexamination Certificate

active

06889427

ABSTRACT:
An apparatus and method for separating a semiconductor die (303) from an adhesive tape (32) are disclosed. The apparatus includes a blade (34) mechanically coupled to a blade holder (36), wherein the blade (34) is inclined relative to the primary surface of the semiconductor die (303). The method further comprises lifting the semiconductor die (303) while it is attached to the adhesive tape (32) to assist disengagement. The blade (34) facilitates peeling of the semiconductor die (303) from the adhesive tape (32) while distributing stress exerted on the semiconductor die (303) over a larger surface area resulting in reduced die fractures (20).

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PCT/US03/03757 PCT Search Report mailed May 9, 2003.

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